BGA HEAT SINK
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| Technical/Catalog Information | 371824B00035 |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | 0.275" (7mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | - |
| Outline | 35.00mm x 35.00mm |
| Thermal Resistance @ Natural | - |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Other Names | 371824B00035 371824B00035 |