372924M02000

      The 372924M02000 is designed for pushing pin attachment method.
      Five features and benefits of 372924M02000 have been concluded as follow.The first one is that its configurations are available for a wide range of BGA package sizes.The second one is that all heat sinks utilize industry standard hole patterns.The third one is that plastic push pins are standard for 1.5mm pc board and 2.5mm thick BGA packages. Consult aavid thermalloy for versions available with brass push pins for more rugged applications or thicker devices.The fourth one is that its minimal diameter holes are necessary for mounting to PC board(see PCB Hole Pattern).The last one is each heat sink utilizes a phase change pad as the interface for optimal performance, unless otherwise noted.That are all the features and the benefits.
      Also something about 372924M02000 should be careful.The first one is that its BGA surface would be all.The second one is that its interface would be none.The third one is that its heat sink finish would be green anodize.The last one is about its part class which would be A.
      Some other things of its length also have been given.The first one is that its width would be 37.4mm.The second one is that its length would be 37.4mm too.The third one is that its height would be 6mm.The fourth one is about its fin thickness across width which would be 1.4mm.The fifth one is about its fin fhickness across length which would be 1.5mm.The sixth one is about its base thickness which would be 1.3mm.The seventh one is about its # of fins across width which should be 9.The last one is about its # of fins across length which should also be 9.
      The thermal performance have two points.The first one is that its *n which should be 32.6 and the second one is about its **f which should be 9.91.