HEATSINK BGA W/O SOLDER ANCHORS
374224B60023G: HEATSINK BGA W/O SOLDER ANCHORS
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| Technical/Catalog Information | 374224B60023G |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Solder Anchor |
| Height | 0.984" (24.99mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | 1W @ 20°C |
| Thermal Resistance @ Forced Air Flow | 6.4°C/W @ 200 LFM |
| Outline | 23.00mm x 23.00mm |
| Thermal Resistance @ Natural | 19.7°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 374224B60023G 374224B60023G HS329 ND HS329ND HS329 |