BGA HEAT SINK
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| Technical/Catalog Information | 374424B00032G |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | 0.71" (18.03mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | 4W @ 80°C |
| Thermal Resistance @ Forced Air Flow | 5°C/W @ 350 LFM |
| Outline | 27.00mm x 27.00mm |
| Thermal Resistance @ Natural | 20.3°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 374424B00032G 374424B00032G |