HEAT SINK FOR BHA
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| Technical/Catalog Information | 375324B00035G |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | 0.4" (10.16mm) |
| Material | - |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | 0.5W @ 40°C |
| Thermal Resistance @ Forced Air Flow | 21.2°C/W @ 200LFM |
| Outline | 10.2mm x 10.2mm |
| Thermal Resistance @ Natural | 71.4°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 375324B00035G 375324B00035G |