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Part Number: 38K50

 

 

 

 

Description: The Quantum38K family, based on a 0.18-mm, six-layer metal CMOS logic process, offers a wide range of ...


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38K50 General Description


The Quantum38K family, based on a 0.18-mm, six-layer metal CMOS logic process, offers a wide range of solutions at very high system performance. With devices ranging from 512 to 1536 macrocells, Quantum38K is the highest density CPLD in the market besides Cypress's Delta39K. Specifically designed to address high-volume communication applications, this family also integrates Cypress's dual-port memory technology onto a CPLD.

The architecture is based on Logic Block Clusters (LBC) that are connected by Horizontal and Vertical (H&V) routing channels. Each LBC features eight individual Logic Blocks (LB). Adjacent to each LBC is a channel memory block, which can be accessed directly from the I/O pins. These channel memory blocks are highly configurable and can be cascaded in width and depth. See Figure 1 for a block diagram of the Quantum38K architecture.

All the members of the Quantum38K family have Cypress's highly regarded In-System Reprogrammability (ISR) feature, which simplifies both design and manufacturing flows, thereby reducing costs. The ISR feature provides the ability to reconfigure the devices without having design changes cause pinout or timing changes in most cases. The Cypress ISR function is implemented through a JTAG-compliant serial interface. Data is shifted in and out through the TDI and TDO pins respectively. Superior routability, simple timing, and the ISR allows users to change existing logic designs while simultaneously fixing pinout assignments and maintaining system performance.

The entire family features JTAG for ISR and boundary scan, and is compatible with the PCI Local Bus specification, meeting the electrical and timing requirements. The Quantum38K family also features user programmable bus-hold and slew rate control capabilities on each I/O pin.

38K50 Maximum Ratings

(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ..................................65°C to +150°C
Soldering Temperature................................................. 220°C
Ambient Temperature with
Power Applied...............................................40°C to +85°C
Junction Temperature ..................................................135°C
VCC to Ground Potential ...................................0.5V to 4.6V
VCCIO to Ground Potential ................................0.5V to 4.6V
DC Voltage Applied to Outputs in High-Z State 0.5V to 4.5V
DC Input voltage...............................................0.5V to 4.5V
DC Current into Outputs ............................................ ±20 mA
Static Discharge Voltage
(per JEDEC EIA/JESD22-A114A) ............................> 2001V
Latch-up Current..................................................... > 200 mA

38K50 Features

• High density
-30K to 100K usable gates
-512 to 1536 macrocells
-136 to 302 maximum I/O pins
-Eight dedicated inputs including four clock pins and
four global I/O control signal pins; four JTAG interface
pins for reconfigurability/boundary scan
• Embedded memory
-16-Kb to 48-Kb embedded dual-port channel memory
• 125-MHz in-system operation
• AnyVolt™interface
-3.3V and 2.5V VCC operation
-3.3V, 2.5V and 1.8V I/O capability
• Low-power operation
-0.18-mm 6-layer metal SRAM-based logic process
-Full-CMOS implementation of product term array
• Simple timing model
-No penalty for using full 16 product terms/macrocell
-No delay for single product term steering or sharing
• Flexible clocking
-Four synchronous clocks per device
-Locally generated product term clock
-Clock polarity control at each register
• Carry-chain logic for fast and efficient arithmetic operations
• Multiple I/O standards supported
-LVCMOS (3.3/3.0/2.5/1.8V), LVTTL, 3.3V PCI
• Compatible with NoBL™, ZBT™, and QDR™ SRAMs
• Programmable slew rate control on each I/O pin
• User-programmable Bus Hold capability on each I/O pin
• Fully 3.3V PCI-compliant (as per PCI spec rev. 2.2)
• Compact PCI hot swap ready
• Multiple package/pinout offering across all densities
-208 to 484 pins in PQFP and FBGA packages
-Simplifies design migration across density
• In-System Reprogrammable™ (ISR™)
-JTAG-compliant on-board configuration
-Design changes do not cause pinout changes
• IEEE1149.1 JTAG boundary scan
• Pin-to-pin-compatible with Cypress's high-end
Delta39K™ CPLDs allowing easy migration path to
-More embedded memory
-Spread Aware™ PLL
-Higher density and higher speed devices
-High speed I/O standards and more

38K50 datasheet


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