Features: Technology 0.5 mm CMOS, three levels of metal Core Size 4.5 mm2 Frequency (CPU : I/O) 2:1 Performance:50 MHz 92 K Dhrystones/sec., 53 DMIPS Voltage Requirements50 MHz 3.3 V ±5% (supports 5V I/Os) Power Dissipation (Est.)50 MHz at 3.3VAverage PowerWaitDozeNapDeep...
401GF: Features: Technology 0.5 mm CMOS, three levels of metal Core Size 4.5 mm2 Frequency (CPU : I/O) 2:1 Performance:50 MHz 92 K Dhrystones/sec., 53 DMIPS Voltage Requirements50 MHz...
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| Technology | 0.5 mm CMOS, three levels of metal |
| Core Size | 4.5 mm2 |
| Frequency (CPU : I/O) | 2:1 |
| Performance: 50 MHz |
92 K Dhrystones/sec., 53 DMIPS |
| Voltage Requirements 50 MHz |
3.3 V ±5% (supports 5V I/Os) |
| Power Dissipation (Est.) 50 MHz at 3.3V Average Power Wait Doze Nap Deep Sleep |
200 mW |
| Max Case Temp. Range | 0° C to +85° C |
| Packaging | 80-Pin TQFP, 63 signal I/Os |