Features: · SUITABLE HIGH PULSE CURRENT OPERATION· EXTRA HIGH RADIANT POWER AND RADIANT INTENSITY· HIGH RELIABILITY· LOW FORWARD VOLTAGESpecifications SYMBOL DESCRIPTION BLUE-GREEN UNIT PAD Power Dissipation Per Chip 120 mW VR Reverse Voltage Per Chip 5 V IF Average Forward...
520PG0C: Features: · SUITABLE HIGH PULSE CURRENT OPERATION· EXTRA HIGH RADIANT POWER AND RADIANT INTENSITY· HIGH RELIABILITY· LOW FORWARD VOLTAGESpecifications SYMBOL DESCRIPTION BLUE-GREEN UNIT P...
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| SYMBOL | DESCRIPTION | BLUE-GREEN | UNIT |
| PAD | Power Dissipation Per Chip | 120 | mW |
| VR | Reverse Voltage Per Chip | 5 | V |
| IF | Average Forward Current Per Chip | 30 | mA |
| - | Derating Linear From 25°C Per Chip | 0.4 | mA/°C |
| Topr | Operating Temperature Range | -25°C to 85°C | |
| Tstg | Storage Temperature Range | -40°C to 85° | |
| Lead Soldering Temperature{1.6mm(0.063 inch) From Body}260°C±5°C For 5 Seconds | |||