533521B02552G

BOARD LEVEL HEAT SINK

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SeekIC No. : 003444326 Detail

533521B02552G: BOARD LEVEL HEAT SINK

floor Price/Ceiling Price

US $ 1.16~1.16 / Piece | Get Latest Price
Part Number:
533521B02552G
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~2500
  • Unit Price
  • $1.16
  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/3/27

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Product Details

Quick Details

Capacitance : 16.5 pF Series: -
Manufacturer: Aavid Thermalloy Type: Board Level, Vertical
Package Cooled: TO-218, TO-247 (Dual) Attachment Method: Clip and PC Pin
Shape: Rectangular Length: 2.000" (50.80mm)
Width: 1.650" (41.91mm) Diameter: -
Height Off Base (Height of Fin): 1.000" (25.40mm) Power Dissipation @ Temperature Rise: 6W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.0°C/W @ 800 LFM Thermal Resistance @ Natural: 4.5°C/W
Material: Aluminum    

Description

Diameter: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Shape: Rectangular
Type: Board Level, Vertical
Length: 2.000" (50.80mm)
Attachment Method: Clip and PC Pin
Height Off Base (Height of Fin): 1.000" (25.40mm)
Width: 1.650" (41.91mm)
Manufacturer: Aavid Thermalloy
Power Dissipation @ Temperature Rise: 6W @ 30°C
Thermal Resistance @ Natural: 4.5°C/W
Thermal Resistance @ Forced Air Flow: 1.0°C/W @ 800 LFM
Package Cooled: TO-218, TO-247 (Dual)


Pinout

  Connection Diagram


Specifications

Part # Description Finish Board Mounting
533521B02552G Extruded heat sink with large radial fins and solderable pins and device clip Black Anodize N/A
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.




Description

Thermal Resistance 4.50

Thermal resistance value of 533521B02552G is based on a 75C rise in natural convection


Parameters:

Technical/Catalog Information533521B02552G
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodClip and PC Pin
Height2" (50.8mm)
MaterialAluminum
Package CooledTO-220
Power Dissipation @ Temperature Rise6W @ 30°C
Thermal Resistance @ Forced Air Flow1.5°C/W @ 500 LFM
Outline41.91mm x 25.40mm
Thermal Resistance @ Natural4.5°C/W
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names 533521B02552G
533521B02552G



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