561LP3E

Features: High Output Power: +14 dBmLow Input Power Drive: 0 to +6 dBmFo Isolation: 15 dBc @ Fout= 16 GHz100 KHz SSB Phase Noise: -139 dBc/HzRoHS Compliant 3x3 mm SMT PackageApplicationThe HMC561LP3 / HMC561LP3E are suitable for:• Clock Generation Applications: SONET OC-192 & SDH STM-64&...

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SeekIC No. : 004233688 Detail

561LP3E: Features: High Output Power: +14 dBmLow Input Power Drive: 0 to +6 dBmFo Isolation: 15 dBc @ Fout= 16 GHz100 KHz SSB Phase Noise: -139 dBc/HzRoHS Compliant 3x3 mm SMT PackageApplicationThe HMC561LP3...

floor Price/Ceiling Price

Part Number:
561LP3E
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/4/17

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Product Details

Description



Features:

High Output Power: +14 dBm
Low Input Power Drive: 0 to +6 dBm
Fo Isolation: 15 dBc @ Fout= 16 GHz
100 KHz SSB Phase Noise: -139 dBc/Hz
RoHS Compliant 3x3 mm SMT Package



Application

The HMC561LP3 / HMC561LP3E are suitable for:
• Clock Generation Applications: SONET OC-192 & SDH STM-64
• Point-to-Point & VSAT Radios
• Test Instrumentation
• Military & Space



Pinout

  Connection Diagram


Specifications

RF Input (Vdd = +5V) 26 dBm (T= +85)
Supply Voltage (Vdd) +10 dBm
Channel Temperature +5.5 Vdc
Channel Temperature(T= 85)
(derate 9.8 mW/ above 85)
150
Thermal Resistance
(channel to ground paddle)
102/W
Storage Temperature -65 to +150
Operating Temperature -40 to +85



Description

The HMC561LP3 & HMC561LP3E are x2 active broadband frequency multipliers utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +5 dBm signal, the multiplier provides +14 dBm typical output power from 8 to 21 GHz and the Fo and 3Fo isolations are 15 dBc at 16 GHz. The HMC561LP3(E) is ideal for use in LO multiplier chains for Pt to Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -139 dBc/Hz at 100 kHz offset helps maintain good system noise performance. The RoHS packaged HMC561LP3(E) eliminates the need for wire bonding, and allows the use of surface mount manufacturing techniques.




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