Heat Sinks SLV HEATSINK TO-263
573300D00010G: Heat Sinks SLV HEATSINK TO-263
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| Product : | Heatsinks | Mounting Style : | SMD/SMT | ||
| Heatsink Material : | Copper | Thermal Resistance : | 18 C / W | ||
| Length : | 12.7 mm | Width : | 26.16 mm | ||
| Height : | 10.16 mm | Designed for : | TO-263 |

| Part # | Description | Finish | Board Mounting |
| 573300D00010G | Surface mount heat sink for D2 Pak (TO-263) package semiconductors | Matte Tin Plated | N/A |
| This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. | |||
| Thermal Resistance | 18.00 |
| Technical/Catalog Information | 573300D00010G |
| Vendor | Aavid Thermalloy (VA) |
| Category | Thermal Management |
| Attachment Method | SMD Pad |
| Height | 0.4" (10.16mm) |
| Material | - |
| Package Cooled | D²Pak |
| Power Dissipation @ Temperature Rise | 1.25W @ 30°C |
| Thermal Resistance @ Forced Air Flow | 10.0°C/W @ 200 LFM |
| Outline | 26.16mm x 12.70mm |
| Thermal Resistance @ Natural | 18°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 573300D00010G 573300D00010G HS338DKR ND HS338DKRND HS338DKR |