Purchase 573400D00010G, In-stock 573400D00010G From SeekIC.
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573400D00010G
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DataSheet
General Description
573400D00010G General Description
| Thermal Resistance | 14.00 |
Thermal resistance value is based on a 75C rise in natural convection
573400D00010G Maximum Ratings
| Part # | Description | Finish | Board Mounting |
| 573400D00010G | Surface mount heat sink for D3 Pak (TO-268) package semiconductors | Matte Tin Plated | N/A |
| This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. | |||
573400D00010G Connection Diagram
- Datasheet:
- File Size: KB
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- · EPCS4SI8
- 226669 KB
- · UTC2411
- 136508 KB
- ·(M5M410092B)
- Mitsubishi
- 3D-RAM
- 1268750 KB
- ·_FCQ30A06
- NIEC [Nihon Inter Electronics Corporation]
- LOW FORWARD VOLTAGE DROP
- 29515 KB
- ·0001.2501.PT
- Fuse
- 40400 KB
- ·0001.2501.TR
- Fuse
- 40400 KB
- ·0001.2502.PT
- Fuse
- 40400 KB
- ·0001.2502.TR
- Fuse
- 40400 KB
573400D00010G Relative Products
573400D00010
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Thermal Resistance 14.00Thermal resistance value of 573400D00000Gis based on a 75C rise in natural convection
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573300D00010G
Thermal Resistance 18.00Thermal resistance value of 573300D00010G is based on a 75C rise in natural convection
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573300D00010
HEATSINK D-PAK .4" HIGH SMD
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