BOARD LEVEL HEAT SINK
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| Capacitance : | 16.5 pF | Series: | - |
| Manufacturer: | Aavid Thermalloy | Type: | Board Level, Vertical |
| Package Cooled: | TO-218 | Attachment Method: | Bolt On and PC Pin |
| Shape: | Rectangular | Length: | 1.00" (25.40mm) |
| Width: | 0.640" (16.26mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.640" (16.26mm) | Power Dissipation @ Temperature Rise: | 2.5W @ 50°C |
| Thermal Resistance @ Forced Air Flow: | 4°C/W @ 500 LFM | Thermal Resistance @ Natural: | 19.6°C/W |
| Material: | Aluminum |

| Part # | Description | Finish | Board Mounting |
| 581001B02500 | Flat back extruded heat sink featuring solderable pins | Black Anodize | View Hole Dimensions |
| This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. | |||
| Thermal Resistance | 19.60 |
| Technical/Catalog Information | 581001B02500 |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Bolt On and PC Pin |
| Height | 1" (25.4mm) |
| Material | Aluminum |
| Package Cooled | TO-218 |
| Power Dissipation @ Temperature Rise | 2.5W @ 50°C |
| Thermal Resistance @ Forced Air Flow | 4°C/W @ 500 LFM |
| Outline | 16.25mm x 16.25mm |
| Thermal Resistance @ Natural | 19.6°C/W |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Other Names | 581001B02500 581001B02500 |