591-3x0x-0xx

Features: • Helps to eliminate mixed technology PC board processing.• Unique patented low part count design.• Compatible with automatic placement equipment.• Compatible with infrared and vapor phase solder processes.• Packaged on 16mm tape, 7 or 13 reels per EIA-481...

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591-3x0x-0xx Picture
SeekIC No. : 004234068 Detail

591-3x0x-0xx: Features: • Helps to eliminate mixed technology PC board processing.• Unique patented low part count design.• Compatible with automatic placement equipment.• Compatible with ...

floor Price/Ceiling Price

Part Number:
591-3x0x-0xx
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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evaluate  (4.8 stars)

Upload time: 2024/4/26

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Product Details

Description



Features:

• Helps to eliminate mixed technology PC board processing.
• Unique patented low part count design.
• Compatible with automatic placement equipment.
• Compatible with infrared and vapor phase solder processes.
• Packaged on 16mm tape, 7" or 13" reels per EIA-481-2.
• Black housing enhances contrast ratio.
• Housing material meets UL94V-0 flammability rating.
• Lens material meets UL94-HB flammability rating.
• Uses LEDs designed specifically for surface mounting.



Specifications

Parameter
-3001
-3101
-3201
-3503
Color*
30
31
32
35
Power Dissipation
100mW
100mW
100mW
150mW Total
Forward DC Current
30mA
30mA
30mA
20mA single chip on
30mA all chips on
Peak Forward Current (10µsec)
500mA
500mA
500mA
Operating Temperature
-55°C to +100°C
Storage Temperature
-55°C to +100°C
Soldering Temperatures
Convection IR
Vapor Phase
235° Peak, above 185° for 90 sec.,
215°C for 3 Min.



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