5962-89785022A

The 5962-89785022A is a high reliability DSCC SMD Class H level two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier with solder dipped pads. The solder contains lead.
The product is capable of operation and storage over the full military temperature range and may also be purchased as either commercial grade or with full MIL-PRF-38534 Class Level K testing on the same DSCC SMD. The 5962-89785022A is manufactured and tested on a MIL-PRF-38534 certified line and included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.
Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated high gain photon detector. The high gain output stage features an open collector output providing both lower saturation voltage and higher signaling speed than possible with conventional photo-Darlington optocouplers. The shallow depth and small junctions offered by the IC process provides better radiation immunity than conventional photo transistor optocouplers.
The supply voltage can be operated as low as 2.0 V without adversely affecting the parametric performance. These devices have a 300% minimum CTR at an input current of only 0.5 mA making them ideal for use in low input current applications such as MOS, CMOS, low power logic interfaces or line receivers. Compatibility with high voltage CMOS logic systems is assured by specifying Icch and Ioh at 18 Volts.
Package styles for this die set with one, two or four channels are 8 and 16-Pin DIP through hole, 16-Pin surface mount DIP flat pack, and 20 pad leadless ceramic chip carrier. Most devices may be purchased with a variety of lead forms and plating options. See the datasheet for details.
Because the same electrical die (emitters and detectors) are used for each channel of each device listed in the datasheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the datasheet figures are virtually identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts performance for reliability and certain limited radiation test results.