MFG:SSOP-20 Package Cooled:. D/C:04+
MFG: SSOP-20
Package Cooled: .
D/C: 04+
Description: The IDT octal bidirectional transceivers are built using an advanced dual metal CMOS technology....
The IDT octal bidirectional transceivers are built using an advanced dual metal CMOS technology. The IDT54/ 74FCT245/A/C, IDT54/74FCT640/A/C and IDT54/74FCT645/A/C are designedfor asynchronous two-way communication between data buses. The transmit/receive (T/R) input deter-mines the direction of data flow through the bidirectionaltransceiver. Transmit (active HIGH) enables data from Aports to B ports, and receive (active LOW) from B ports to Aports. The output enable (OE) input, when HIGH, disablesboth A and B ports byplacing them in High-Z condition. The IDT54/74FCT245/A/C and IDT54/74FCT645/A/C transceivers have non-inverting outputs. The IDT54/74FCT640/A/C has inverting outputs.
| Symbol | Rating | Commercial | Military | Unit |
| VTERM(2) | Terminal Voltage with Respect to GND |
0.5 to +7.0 | 0.5 to +7.0 | V |
| TERM(3) | Terminal Volta with Respect to GND |
0.5 to VCC | 0.5 to VCC | V |
| TA | Operating Temperature | 0 to +70 | 55 to +125 | |
| TBIAS | Temperature Under Bias | 55 to +125 | 65 to +135 | |
| TSTG | Storage Temperature | 55 to +125 | 65 to +150 | |
| PT | Power Dissipation | 0.5 | 0.5 | W |
| IOUT | DC Output Current | 120 | 120 | mA |
| Symbol | Rating | Commercial | Military | Unit |
| VTERM(2) | Terminal Voltage with Respect to GND |
0.5 to +7.0 | 0.5 to +7.0 | V |
| TERM(3) | Terminal Volta with Respect to GND |
0.5 to VCC | 0.5 to VCC | V |
| TA | Operating Temperature | 0 to +70 | 55 to +125 | °C |
| TBIAS | Temperature Under Bias | 55 to +125 | 65 to +135 | °C |
| TSTG | Storage Temperature | 55 to +125 | 65 to +150 | °C |
| PT | Power Dissipation | 0.5 | 0.5 | W |
| IOUT | DC Output Current | 120 | 120 | mA |
74F00
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The IDT octal buffer/line driver is built using an advanced dual metal CMOS technology. The 74FCT244T is designed to be employed as a memory and address driver, clock driver, and bus-oriented transmitter/ receiver which provides improved board density.
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