MFG:ST Package Cooled:TSSOP-48 D/C:05+
MFG: ST
Package Cooled: TSSOP-48
D/C: 05+
Description: The LCXH16245 contains sixteen non-inverting bidirectional buffers with 3-STATE outputs and is intended for bus orie...
The LCXH16245 contains sixteen non-inverting bidirectional buffers with 3-STATE outputs and is intended for bus oriented applications. The device is designed for low voltage (2.5V or 3.3V) VCC applications with capability of interfacing to a 5V signal environment. The device is byte controlled. Each byte has separate control inputs which could be shorted together for full 16-bit operation.
The T/R inputs determine the direction of data flow through the device. The OE inputs disable both the A and B Ports by placing them in a high impedance state.
The LCXH16245 data inputs include active bushold circuitry, eliminating the need for external pull-up resistors to hold unused or floating data inputs at a valid logic level.
The LCXH16245 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining CMOS low power dissipation.
| Symbol | Parameter | Value | Conditions | Units |
| VCC | Supply Voltage | −0.5 to +7.0 | V | |
| VI | DC Input Voltage | −0.5 to VCC + 0.5 | V | |
| VO | DC Output Voltage | −0.5 to +7.0 −0.5 to VCC + 0.5 |
Output in 3-STATE Output in HIGH or LOW State (Note 4) |
V |
| IIK | DC Input Diode Current | −50 | VI < GND | mA |
| IOK | DC Output Diode Current | −50 +50 |
VO < GND VO > VCC |
mA |
| IO | DC Output Source/Sink Current | ±50 | mA | |
| ICC | DC Supply Current per Supply Pin | ±100 | mA | |
| IGND | DC Ground Current per Ground Pin | ±100 | mA | |
| TSTG | Storage Temperature | −65 to +150 | °C |
`2.3V3.6V VCC specifications provided
`4.5 ns tPD max (VCC = 3.3V), 20 µA ICC max
`Power-down high impedance outputs
`Bushold on inputs eliminates the need for external pull-up/pull-down resistors
`±24 mA output drive (VCC = 3.0V)
`Implements patented noise/EMI reduction circuitry
`Latch-up performance conforms to the requirements of JESD78
`ESD performance:
`Human body model > 2000V
`Machine model > 200V
`Also packaged in plastic Fine-Pitch Ball Grid Array(FBGA)
74LCXH16245
PDF/DataSheet Download
IC BUFF DVR 16BIT LOW V 48TSSOP
IC BUFFER/LDRIVER 16BIT 48TSSOP
IC BUFF DVR 16BIT LOW V 48SSOP
IC BUFFER/LDRIVER 16BIT 48SSOP
IC BUFF DVR 16BIT LOW V 54FBGA
IC BUFFER/LDRIVER 16BIT 54FBGA
Price: 2.6-4 USD
rail-to-rail CMOS operational amplifier, 14SOIC, 7.5V, 10mA, single supply capability
Price: 3-4 USD
monolithic integrated circuit, 16DIP, 25mA, 18mW, +7.0V, CA3161E
Price: 0.8-1 USD
Dual chord IC, 265 notes dual tone, Mosdesign Semiconductor Corporation, DIP
Price: 1-2 USD
Chunghwa, 10.1" WSVGA, laptop led panel screen, TFT, Response Time 30ms, Interface Type DVI
Price: 0.1-100 USD
HE relay, 25A, 24VDC, 1.92 W, 300 Ohms, Excellent resistance, High-capacity, Excellent surge resis...
Price: 0.23-0.53 USD
quad EIA-422/3 receiver, SOP16, four independent receiver chains, three-state outputs, 5.0V
Price: 0.001-0.1 USD
amplifier, TO-92, 32V
Price: 0.1-50 USD
transmission controller, SOP, -0.3 to 7.0V, 780mW, Low current consumption
Price: 100-120 USD
SKM150GB124DE, Low Loss IGBT Modules, 1200V, 150A, Semikron
Price: 1-2 USD
UHF power LDMOS transistor, SOT540A, 600MHz, 65V, 18A, 14.5dB
Price: 5-6 USD
single-chip, 10/100 Mb/s Ethernet Controller, QFP, -0.5 V to 3.6 V, IEEE 802.3 Compliant
Price: 2.8-3.7 USD
8-DIP, LF442ACN+, operational amplifiers, ±22V, 400 μA, 1 MHz
