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84-1LMISR4

Features: • Excellent dispensability with minimal tailing and stringing• Box oven cureDescriptionABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhe...

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SeekIC No. : 004256044 Detail

84-1LMISR4: Features: • Excellent dispensability with minimal tailing and stringing• Box oven cureDescriptionABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated ...

84-1LMISR4 Data Sheet

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Part Number:
84-1LMISR4
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

• Excellent dispensability with minimal tailing and stringing
• Box oven cure


Description

ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.




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