A100J15C0GH5UAA

The basic capacitor construction consists of ceramic dielectric materials processed into a tape with a typical thickness range from 0.025 to 0.076 mm. Metal electrode patterns are applied using a thick film screening process. Multiple layers are stacked and laminated in such a manner that electrodes are alternately exposed when the pattern is cut into individual chip capacitors.

The capacitors are fired through a high temperature profile to mature the ceramic and metal into a homogeneous unit. Metal end terminations are applied and fired to provide electrical connection between the individual layers. Tinned leads are attached using a solder. Encapsulation consists of a moisture resistant gold colour conformal epoxy coating that meets the flame requirements of "UL94V-0".