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Part Number: A81L801

 

 

 

 

Description: The Flash memory of A81L801 is an 8Mbit, 3.0 volt-only memory organized as 1,048,576 bytes of 8 bits o...


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A81L801 General Description


The Flash memory of A81L801 is an 8Mbit, 3.0 volt-only memory organized as 1,048,576 bytes of 8 bits or 524,288 words of 16 bits each. The 8 bits of data appear on I/O0 - I/O7;the 16 bits of data appear on I/O0~I/O15. The A81L801 is offered in 69-ball TFBGA package. This device is designed to be programmed in-system with the standard system 3.0 volt VCC supply. Additional 12.0 volt VPP is not required for insystem write or erase operations. However, the A81L801 can also be programmed in standard EPROM programmers.

The Flash memory of A81L801 has the first toggle bit, I/O6,which indicates whether an Embedded Program or Erase is in progress, or it is in the Erase Suspend. Besides the I/O6 toggle bit, the Flash memory of A81L801 also has a second toggle bit, I/O2, to indicate whether the addressed sector is being selected for erase. The A81L801 also offers the ability to program in the Erase Suspend mode. The standard A81L801 offers access times of 70 and 90ns, allowing high-speed microprocessors to operate without wait states. To eliminate bus contention the device has separate chip enables (CE_F ,and CE_S ), write enable ( WE ) and output enable ( OE ) controls.

The device requires only a single 3.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations.

The Flash memory of A81L801 is entirely software command set compatible with the JEDEC single-power-supply Flash
standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.

Device programming occurs by writing the proper program command sequence. This initiates the Embedded Program algorithm - an internal algorithm that automatically times the program pulse widths and verifies proper program margin.

Device erasure occurs by executing the proper erase command sequence. This initiates the Embedded Erase algorithm - an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper erase margin. The Unlock Bypass mode facilitates faster programming times by requiring only two write cycles to program data instead of four.

The host system can detect whether a program or erase operation is complete by observing the RY / BY pin, or by reading the I/O7 (Data Polling) and I/O6 (toggle) status bits.After a program or erase cycle has been completed, the device is ready to read array data or accept another command. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The Flash memory of A81L801 is fully erased when shipped from the factory.

The hardware sector protection feature disables operations for both program and erase in any combination of the sectors of memory. This can be achieved via programming equipment.The Erase Suspend/Erase Resume feature enables the user to put erase on hold for any period of time to read data from,or program data to, any other sector that is not selected forerasure. True background erase can thus be achieved.

The hardware RESET pin terminates any operation in progress and resets the internal state machine to reading array data. The RESET pin may be tied to the system reset circuitry. A system reset would thus also reset the device,enabling the system microprocessor to read the boot-up firmware from the Flash memory.

The A81L801 device offers two power-saving features. When addresses have been stable for a specified amount of time,the device enters the automatic sleep mode. The system can also place the device into the standby mode. Power
consumption is greatly reduced in both these modes.

A81L801 Maximum Ratings

Storage Temperature Plastic Packages. . . . . .-65°C to + 150°C
Ambient Temperature with Power Applied . . . -55°C to + 125°C
Voltage with Respect to Ground VCC_F/VCC_S . . . . . . . . (Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +4.0V
A9, OE & RESET (Note 2) . . . . . . . . . . . . . . . . . . . . -0.5 to +12.5V
All other pins (Note 1) . . . . . .. . . . -0.5V to VCC_F/VCC_ S + 0.5V
Output Short Circuit Current (Note 3) . . . . . . . . . . . . . . . . 200mA
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, input or I/O pins may undershoot VSS to -2.0V for periods of up to 20ns. Maximum DC voltage on input and I/O pins is VCC_F/VCC_S +0.5V. During voltage
transitions, input or I/O pins may overshoot to VCC_F/VCC_S +2.0V for periods up to 20ns.
2. Minimum DC input voltage on A9,OE and RESET is - 0.5V. During voltage transitions, A9,OE and RESET may overshoot VSS to -2.0V for periods of up to 20ns. Maximum DC input voltage on A9 is +12.5V which may overshoot to
14.0V for periods up to 20ns.
3. No more than one output is shorted at a time. Duration of the short circuit should not be greater than one second.

A81L801 Features

MCP Features
`Single power supply operation 2.7 to 3.6 volt
`High Performance
   - Access time as fast as 70ns
`Package
   - 69-Ball FBGA (8x11x1.4 mm)
`Industrial operating temperature range: -25°C to 85°C for I Flash Features
`Single power supply operation
    - Full voltage range: 2.7 to 3.6 volt read and write
`operations for battery-powered applications
`Access times:
   - 70 (max.)
`Current:
   - 9 mA typical active read current
   - 20 mA typical program/erase current
   - 200 nA typical CMOS standby
   - 200 nA Automatic Sleep Mode current
`Flexible sector architecture
   - 16 Kbyte/ 8 KbyteX2/ 32 Kbyte/ 64 KbyteX15 sectors
   - 8 Kword/ 4 KwordX2/ 16 Kword/ 32 KwordX15 sectors
   - Any combination of sectors can be erased
   - Supports full chip erase
   - Sector protection:
A hardware method of protecting sectors to prevent any inadvertent program or erase operations within that sector.
Temporary Sector Unprotect feature allows code changes in previously locked sectors
`Extended operating temperature range: -25°C ~ +85°C for I series
`Unlock Bypass Program Command
   - Reduces overall programming time when issuing multiple program command sequence
`Top or bottom boot block configurations available
`Embedded Algorithms
   - Embedded Erase algorithm will automatically erase the entire chip or any combination of designated sectors and verify the erased sectors
   - Embedded Program algorithm automatically writes and verifies data at specified addresses
`Typical 100,000 program/erase cycles per sector
`20-year data retention at 125°C
    - Reliable operation for the life of the system
`Data Polling and toggle bits
    - Provides a software method of detecting completion of program or erase operations
`Ready / BUSY pin (RY / BY)
    - Provides a hardware method of detecting completion of program or erase operations
`Erase Suspend/Erase Resume
   - Suspends a sector erase operation to read data from, or program data to, a non-erasing sector, then resumes the
erase operation
`Hardware reset pin (RESET )
    - Hardware method to reset the device to reading array data LP SRAM Features
`Power supply range: 2.7V to 3.6V
`Access times: 70 ns (max.)
`Current:Very low power version: Operating: 30mA(max.)
     Standby: 5uA (max.)
`Full static operation, no clock or refreshing required
`All inputs and outputs are directly TTL-compatible
`Common I/O using three-state output
`Output enable and two chips enable inputs for easy application
`Data retention voltage: 2.0V (min.)

A81L801 datasheet

A81L801
PDF/DataSheet Download

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