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Part Number: AD14160

 

 

 

 

Description: The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array (CBGA) puts the power of the first generation ...


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AD14160 General Description


The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array (CBGA) puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid array package; now with additional link and serial I/O pinned out, beyond that from the CQFP package. The core of the multiprocessor is the ADSP-21060 DSP microcomputer. The AD14x60 modules have the highest performance-density and lowest cost- performance ratios of any in their class. They are ideal for applications requiring higher levels of performance and/or functionality per unit area.

The AD14160/AD14160L takes advantage of the built-in multiprocessing features of the ADSP-21060 to achieve 480 peak MFLOPS with a single chip type, in a single package. The onchip SRAM of the DSPs provides 16 Mbits of on-module shared SRAM. The complete shared bus (48 data, 32 address) is also brought off-module for interfacing with expansion memory or other peripherals.

The ADSP-21060 link ports are interconnected to provide direct communication among the four SHARCs as well as high
speed off-module access. Internally, links connect the SHARC in a ring. Externally, each SHARC has a total of 160 Mbytes/s link port bandwidth.

Multiprocessor performance is enhanced with embedded power and ground planes, matched impedance interconnect, and optimized signal routing lengths and separation. The fully tested and ready-to-insert multiprocessor also significantly reduces board space.

AD14160 Maximum Ratings

Supply Voltage (5 V) . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
Supply Voltage (3.3 V) . . . . . . . . . . . . . . . . 0.3 V to +4.6 V
Input Voltage . . . . . . . . . . . . . . . . . . .0.5 V to VDD + 0.5 V
Output Voltage Swing . . . . . . . . . . . . 0.5 V to VDD + 0.5 V
Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF
Junction Temperature Under Bias . . . . . . . . . . . . . . . 130°C
Storage Temperature Range . . . . . . . . .65°C to +150°C
Solder Ball Temperature (5 seconds) . . . . . . . . . . . +230°C

*Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

AD14160 Features

PERFORMANCE FEATURES
`
ADSP-21060 Core Processor (. . . *4)
`480 MFLOPS Peak, 320 MFLOPS Sustained
`25 ns Instruction Rate, Single-Cycle Instruction ExecutionEach of Four Processors
`16 Mbit Shared SRAM (Internal to SHARCs)
`4 Gigawords Addressable Off-Module Memory
`Sixteen 40 Mbyte/s Link Ports (Four per SHARC)
`Eight 40 Mbit/s Independent Serial Ports (Two from Each SHARC)
`5 V and 3.3 V Operation
`32-Bit Single Precision and 40-Bit Extended
`Precision IEEE Floating Point Data Formats, or 32-Bit Fixed Point Data Format
`IEEE JTAG Standard 1149.1 Test Access Port and On-Chip Emulation
PACKAGING FEATURES
`452-Lead Ceramic Ball Grid Array (CBGA)
`1.85" (47 mm) Body Size
`0.200" Max Height
`0.050" Ball Pitch
`29 Grams (typical)
`JC = 0.368/W

AD14160 datasheet

AD14160
PDF/DataSheet Download

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