AD5263

V_DD to GND....................0.3 V to +16.5 V
V_SS to GND............................0 V to +7.5 V
V_DD to V_{SS.....................................}+16.5 V
V_L to GND........................0.3 V to +6.5 V
V_A, V_B, V_W to GND....................V_SS to V_DD
Terminal Current, Ax-Bx, Ax-Wx, Bx-Wx
   Pulsed1...................................±20 mA
Continuous....................................±3 mA
Digital Inputs and Output Voltage to GND...0 V to +7 V
Operating Temperature Range........40°C to +85°C
Maximum Junction Temperature (T_{J MAX})............150°C
Storage Temperature......................65°C to +150°C
Lead Temperature (Soldering, 10 sec)................300°C
Vapor Phase (60 sec)..........................................215°C
Infrared (15 sec).................................................220°C
Thermal Resistance² _JA
TSSOP-24.......................................................143°C/W

1 Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A, B, and W terminals at a given resistance.
2 Package power dissipation: (T_JMAX T_A)/_JA.

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.