AD5290

V_DD to GND........................−0.3 V, +35 V
V_SS to GND.....................+0.3 V, −16.5 V
V_DD to VSS........................−0.3 V, +35 V
V_A, V_B, VW to GND....................V_SS, V_DD
Maximum Current
  I_WB, I_WA Pulsed.....................±20 mA
  I_WB Continuous (R_WB 6 k, A Open,...±5 mA
     V_DD/V_SS = 30 V/0 V)1
   I_WA Continuous (R_WA 6 k, B Open,..±5 mA
     V_DD/V_SS = 30 V/0 V)1
Digital Input and Output Voltages to GND...0 V, +7 V
Operating Temperature Range....−40°C to +125°C
Maximum Junction Temperature (T_JMAX)2.....+150°C
Storage Temperature...................−65°C to +150°C
Lead Temperature (Soldering, 10 sec to 30 sec)..245°C
Thermal Resistance2 _JA: MSOP-10.............230°C/W

1 The maximum terminal current is bound by the maximum current handling of the switches, maximum power dissipation of the package, and the maximum applied voltage across any two of the following at a given resistance: A terminal, B terminal, and W terminal.
2 Package power dissipation = (T _JMAX T_A)/_JA.

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.