AD5371

V_DD to AGND...............................−0.3 V to +17 V
V_SS to AGND...............................−17 V to +0.3 V
V_CC to DGND................................−0.3 V to +7 V
Digital Inputs to DGND......−0.3 V to VCC + 0.3 V
Digital Outputs to DGND...−0.3 V to V_CC + 0.3 V
V_REF1(+), V_REF2(+) to AGND.......−0.3 V to +7 V
V_REF1(−), V_REF2(−) to AGND..V_SS− 0.3 V to V_DD + 0.3 V
VBIAS to AGND.............................−0.3 V to +7 V
V_OUT0V_OUT31 to AGND......V_SS − 0.3 V to V_DD + 0.3 V
REFGND to AGND..................V_SS − 0.3 V to V_DD + 0.3 V
AGND to DGND.........................−0.3 V to +0.3 V
Operating Temperature Range (TA)
Industrial (A Version)...........................−40°C to +85°C
Storage Temperature Range.............−65°C to +150°C
Junction Temperature (T_J max)............................130°C
108-Lead CSPBGA Package
    _JA Thermal Impedance
    80-LQFP ..........................................38.72°C/w
      100-CSPBGA .....................................40°C/w
Reflow Soldering
Peak Temperature.....................................230°C
Time at Peak Temperature.............10 sec to 40 sec

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.