AD5530

V_DD to GND . . . . . . . . . . . . . . . . . . . . . . . . . .  0.3 V, +17 V
V_SS to GND . . . . . . . . . . . . . . . . . . . . . . . . . .  +0.3 V, 17 V
Digital Inputs to GND . . . . . . . . . . . . . 0.3 V to V_DD +0.3 V
SDO to GND . . . . . . . . . . . . . . . . . . . . . . . .0.3 V to +6.5 V
REFIN to REFAGND . . . . . . . . . . . . . . . . . . . . 0.3 V, +17 V
REFIN to GND . . . . . . . . . . . . . . . . V_SS 0.3 V, V_DD +0.3 V
REFAGND to GND . . . . . . . . . . . . . V_SS 0.3 V, V_DD +0.3 V
DUTGND to GND . . . . . . . . . . . . . . V_SS 0.3 V, V_DD +0.3 V
Operating Temperature Range
    Industrial (B Version) . . . . . . . . . . . . .  40°C to +85°C
Storage Temperature Range . . . . . . . . . 65°C to +150°C
Maximum Junction Temperature (T_{J MAX}) . . . . . . . . . . 150°C
Package Power Dissipation . . . . . . . . . . .  (T_{J MAX} T_A)/_JA
Thermal Impedance _JA
        TSSOP (RU-16) . . . . . . . . . . . . . . . . . . . . . . 150.4°C/W
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . .  300°C
IR Reflow, Peak Temperature (< 20 sec) . . . . . . . . . .  235°C
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.