AD7390

V_DD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3 V, +8 V
V_REF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V, VDD +0.3 V
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . .  -0.3 V, +8 V
V_OUT to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V, VDD+ 0.3 V
I_OUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package Power Dissipation . . . . . . . . . . . . . . . . . . . . (T_J MAX- T_A)/_JA
Thermal Resistance JA
8-Lead Plastic DIP Package (N-8) . . . . . . . . . . . . . . . . . . . . 103°C/W
8-Lead SOIC Package (SO-8) . . . . . . . . . . . . . . . . . . . . . . . 158°C/W
TSSOP-8 Package (RU-8) . . . . . . . . . . . . . . . . . . . . . . . . . .  240°C/W
Maximum Junction Temperature (T_J MAX) . . . . . . . . . . . . . . . . -150°C
Operating Temperature Range . . . . . . . . . . . . . . . . . -40°C to +85°C
AD7391AR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . . . . .  -65°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . . . . . . . -300°C
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational specification is not implied. Exposure to the above maximum rating conditions for extended periods may affect device reliability.