AD7392

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..0.3 V, +8 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 0.3 V, VDD
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . ... .0.3 V, +8 V
VOUT to GND . . . . . . . . . . . . . . . . . . . . . ..0.3 V, VDD + 0.3 V
IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . ...... 50 mA
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . ...... 0.3 V, +2 V
Package Power Dissipation . . . . . . . . . . . . . (TJ max TA)/JA
Thermal Resistance qJA
20-Lead Plastic DIP Package (N-20) . . . . . . . . . . . ........57/W
20-Lead SOIC Package (R-20) . . . . . . . . . . . . . . . ........ 60/W
20-Lead Thin-Shrink Surface Mount (RU-20) . . ........... 155/W
Maximum Junction Temperature (TJ max) . . . . . . . . ...... . 150
Operating Temperature Range . . . . . . . . . . . ....40 to +85
AD7393AR . . . . . . . . . . . . . . . . . . . . . . . . . ......40 to +125
Storage Temperature Range . . . . . . . . . . . ...... 65to +150
Lead Temperature
N-20 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . .......... .+300
R-20 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . ......... .+215
RU-20 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . .......... .+220

*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.