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MFG:ADI D/C:09
Part Number: AD7804
MFG: ADI
D/C: 09
Description: The AD7804/AD7808 are quad/octal 10-bit digital-to-analog converters, with serial load capabilities, w...
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AD7804
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DataSheet
General Description
AD7804 General Description
The AD7804/AD7808 are quad/octal 10-bit digital-to-analog converters, with serial load capabilities, while the AD7805/AD7809 are quad/octal 10-bit digital-to-analog converters with parallel load capabilities. These parts operate from a +3.3 V to +5 V (±10%) power supply and incorporates an on-chip reference.
These DACs provide output signals in the form of VBIAS ± VSWING. VSWING is derived internally from VBIAS. On-chip control registers include a system control register and channel control registers. The system control register has control over all DACs in the package. The channel control registers allow individual control of DACs. The complete transfer function of each individual DAC can be shifted around the VBIAS point using an on-chip Sub DAC. All DACs contain double buffered data inputs, which allow all analog outputs to be simultaneously updated using the asynchronous LDAC input.
AD7804 Maximum Ratings
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . .0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . ..0.3 V + 0.3 V
Digital Input Voltage to DGND . . . . .. 0.3 V to DVDD + 0.3 V
Analog Input Voltage to AGND . . . . . .0.3 V to AVDD + 0.3 V
COMP to AGND . . . . . . . . . . . . . . . . . .0.3 V to AVDD + 0.3 V
REF OUT to AGND . . . . . . . . . . . . . . . . . . . . 0.3 V to + AVDD
REF IN to AGND . . . . . . . . . . . . . . . . . 0.3 V to AVDD + 0.3 V
VOUT to AGND2 . . . . . . . . . . . . . . . . .. 0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies3 . . . . . . . .. ±10 mA
Operating Temperature Range
AD7804/AD7805 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . .. .40°C to +85°C
AD7808/AD7809 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . . . 40°C to +85°C
Storage Temperature Range . . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
SOIC (R-16) Package, Power Dissipation . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
SOIC (R-24) Package, Power Dissipation . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PDIP (N-24) Package, Power Dissipation . . . . . . . . . 670 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260°C
SOIC (R-28) Package, Power Dissipation . . . . . . . . . 875 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 70°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PDIP (N-28) Package, Power Dissipation . . . . . . . . . 875 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260°C
SSOP (RS-28) Package, Power Dissipation . . . . . . .. 875 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . .. +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
TQFP (ST-44B) Package, Power Dissipation . . . . . . .450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .116°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2The outputs may be shorted to voltages in this range provided the power dissipation of the package is not exceeded.
3Transient currents of up to 100 mA will not cause SCR latch-up.
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . .0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . ..0.3 V + 0.3 V
Digital Input Voltage to DGND . . . . .. 0.3 V to DVDD + 0.3 V
Analog Input Voltage to AGND . . . . . .0.3 V to AVDD + 0.3 V
COMP to AGND . . . . . . . . . . . . . . . . . .0.3 V to AVDD + 0.3 V
REF OUT to AGND . . . . . . . . . . . . . . . . . . . . 0.3 V to + AVDD
REF IN to AGND . . . . . . . . . . . . . . . . . 0.3 V to AVDD + 0.3 V
VOUT to AGND2 . . . . . . . . . . . . . . . . .. 0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies3 . . . . . . . .. ±10 mA
Operating Temperature Range
AD7804/AD7805 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . .. .40°C to +85°C
AD7808/AD7809 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . . . 40°C to +85°C
Storage Temperature Range . . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
SOIC (R-16) Package, Power Dissipation . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
SOIC (R-24) Package, Power Dissipation . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PDIP (N-24) Package, Power Dissipation . . . . . . . . . 670 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260°C
SOIC (R-28) Package, Power Dissipation . . . . . . . . . 875 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 70°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PDIP (N-28) Package, Power Dissipation . . . . . . . . . 875 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260°C
SSOP (RS-28) Package, Power Dissipation . . . . . . .. 875 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . .. +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
TQFP (ST-44B) Package, Power Dissipation . . . . . . .450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .116°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2The outputs may be shorted to voltages in this range provided the power dissipation of the package is not exceeded.
3Transient currents of up to 100 mA will not cause SCR latch-up.
AD7804 Features
Four 10-Bit DACs in One Package
Serial and Parallel Loading Facilities Available
AD7804 Quad 10-Bit Serial Loading
AD7805 Quad 10-Bit Parallel Loading
AD7808 Octal 10-Bit Serial Loading
AD7809 Octal 10-Bit Parallel Loading
+3.3 V to +5 V Operation
Power-Down Mode
Power-On Reset
Standby Mode (All DACs/Individual DACs)
Low Power All CMOS Construction
10-Bit Resolution
Double Buffered DAC Registers
Dual External Reference Capability
Serial and Parallel Loading Facilities Available
AD7804 Quad 10-Bit Serial Loading
AD7805 Quad 10-Bit Parallel Loading
AD7808 Octal 10-Bit Serial Loading
AD7809 Octal 10-Bit Parallel Loading
+3.3 V to +5 V Operation
Power-Down Mode
Power-On Reset
Standby Mode (All DACs/Individual DACs)
Low Power All CMOS Construction
10-Bit Resolution
Double Buffered DAC Registers
Dual External Reference Capability
AD7804 Typical Application
Optical Disk Drives
Instrumentation and Communication Systems Process Control and Voltage Setpoint Control
Trim Potentiometer Replacement
Automatic Calibration
Instrumentation and Communication Systems Process Control and Voltage Setpoint Control
Trim Potentiometer Replacement
Automatic Calibration
AD7804 Connection Diagram
AD7804
PDF/DataSheet Download
- Datasheet: AD7804
- File Size: 328768 KB
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- Click here to Download
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- ·AD7002
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