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MFG:ADI D/C:09
Part Number: AD7810
MFG: ADI
D/C: 09
Description: The AD7810 is a high speed, low power, 10-bit A/D converter that operates from a single 2.7 V to 5.5 V...
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AD7810
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DataSheet
General Description
AD7810 General Description
The AD7810 is a high speed, low power, 10-bit A/D converter that operates from a single 2.7 V to 5.5 V supply. The part contains a 2.3 s successive approximation A/D converter, with inherent track/hold functionality, a pseudo differential input and a high speed serial interface that interfaces to most microcontrollers. The AD7810 is fully specified over a temperature range of 40°C to +105°C.
By using a technique that samples the state of the CONVST (convert start) signal at the end of a conversion, the AD7810 may be used in an automatic power-down mode. When used in this mode, the AD7810 automatically powers down at the end of a conversion and "wakes up" at the start of a new conversion. This feature significantly reduces the power consumption of the part at lower throughput rates. The AD7810 can also operate in a high speed mode where the part is not powered down between conversions. In this high speed mode of operation, the conversion time of the AD7810 is 2.3 s. The maximum throughput rate is dependent on the speed of the serial interface of the microcontroller.
The part is available in a small 8-lead, 0.3" wide, plastic dualin- line package (mini-DIP); in an 8-lead, small outline IC (SOIC); and in an 8-lead microSOIC package.
AD7810 Maximum Ratings
VDD to GND . . . . . . . . . . . . . . . . . . .. . . 0.3 V to +7 V
Digital Input Voltage to GND
(CONVST, SCLK) . . . . . . . . . . .. . .. 0.3 V, VDD + 0.3 V
Digital Output Voltage to GND
(DOUT) . . . . . . . . . . . . . . . . . . . . . 0.3 V, VDD + 0.3 V
VREF to GND . . . . . . . . . . . . .. . .. . 0.3 V, VDD + 0.3 V
Analog Inputs
(VIN+, VIN) . . . . . . . . . . . . . . . . . 0.3 V, VDD + 0.3 V
Storage Temperature Range . . . . .65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . 150°C
Plastic DIP Package, Power Dissipation . . . .. . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . 125°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . 50°C/W
Lead Temperature Soldering (10 sec) . . . . . . . 260°C
SOIC Package, Power Dissipation . . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . .. . . . 160°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . .. . 56°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . .. . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . ... 220°C
MicroSOIC Package, Power Dissipation . . . .. . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . 206°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . . 44°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . .. . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . .. . . . . .220°C
Digital Input Voltage to GND
(CONVST, SCLK) . . . . . . . . . . .. . .. 0.3 V, VDD + 0.3 V
Digital Output Voltage to GND
(DOUT) . . . . . . . . . . . . . . . . . . . . . 0.3 V, VDD + 0.3 V
VREF to GND . . . . . . . . . . . . .. . .. . 0.3 V, VDD + 0.3 V
Analog Inputs
(VIN+, VIN) . . . . . . . . . . . . . . . . . 0.3 V, VDD + 0.3 V
Storage Temperature Range . . . . .65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . 150°C
Plastic DIP Package, Power Dissipation . . . .. . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . 125°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . 50°C/W
Lead Temperature Soldering (10 sec) . . . . . . . 260°C
SOIC Package, Power Dissipation . . . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . .. . . . 160°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . .. . 56°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . .. . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . ... 220°C
MicroSOIC Package, Power Dissipation . . . .. . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . 206°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . . 44°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . .. . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . .. . . . . .220°C
AD7810 Features
`10-Bit ADC with 2.3 s Conversion Time
`Small Footprint 8-Lead microSOIC Package
`Specified Over a 40 to +105 Temperature Range
`Inherent Track-and-Hold Functionality
`Operating Supply Range: 2.7 V to 5.5 V
`Specifications at 2.7 V to 5.5 V
`Microcontroller-Compatible Serial Interface
`Optional Automatic Power-Down
at End of Conversion
`Low Power Operation
270 W at 10 kSPS Throughput Rate
2.7 mW at 100 kSPS Throughput Rate
`Analog Input Range: 0 V to VREF
`Reference Input Range: 0 V to VDD
AD7810 Typical Application
Low Power, Hand-Held Portable Applications that Require Analog-to-Digital Conversion with 10-Bit Accuracy; e.g., Battery Powered Test Equipment, Battery-Powered Communications Systems
AD7810 Connection Diagram
AD7810
PDF/DataSheet Download
- Datasheet: AD7810
- File Size: 168867 KB
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