AD7896

V_DD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
V_DD to DGND. . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
Analog Input Voltage to AGND . . . . . . 0.3 V to V_DD + 0.3 V
Digital Input Voltage to DGND . . . . . . 0.3 V to V_DD + 0.3 V
Digital Output Voltage to DGND . . . . . 0.3 V to V_DD + 0.3 V
Operating Temperature Range
Commercial (J Version) . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial (A, B Versions) . . . . . . . . . . . . .40°C to +85°C
Extended (S Version) . . . . . . . . . . . . . .  55°C to +125°C
Storage Temperature Range . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . .   +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . .  125°C/W
qJC Thermal Impedance. . . . . . . . . . . . . . . . . . . . . . 50°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . .  +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . .. 450 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .160°C/W
qJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .   +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .   +220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4000 V
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.