AD815ARB-24

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . .  18 V Total Internal Power
Dissipation2 Plastic (Y and VR)  . .  3.05 Watts (Observe Derating Curves) Small Outline (RB)  . . 
2.4 Watts (Observe Derating Curves)Input Voltage (Common Mode)  . . . . . . . . . . . . . . . . . .
. . VS Differential Input Voltage  . . . . . . . . . . . . . . . . . . . . . . . .  6 V  Output
Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . .  Observe Power Derating Curves Can
Only Short to Ground Storage Temperature Range Y, VR and RB Package . . . . . . . . . . . . . . . 
65 C to +125 C Operating Temperature Range AD815A . . . . . . . . . . . . . . . . . . . . . . . . .
. .  40 C to +85 C Lead Temperature Range (Soldering, 10 sec)  . . . . . . . +300 C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device.
This is a stress rating only; functional operation of the device at these or any other conditions above
those indicated in the operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.2Specification is for device
in free air with 0 ft/min air flow: 15-Lead Through-Hole and Surface Mount: q JA = 41 C/W; 24-Lead Surface
Mount: q JA = 52 C/W.

The maximum power that can be safely dissipated by the AD815 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for the plastic encapsulated parts is determined by the
glass transition temperature of the plastic, about 150 C.  Exceeding this limit temporarily may cause a shift
in parametric performance due to a change in the stresses exerted on the die by the package.  Exceeding a
junction temperature of 175 C for an extended period can result in device failure.The AD815 has thermal shutdown
protection, which guarantees that the maximum junction temperature of the die remains below a safe level, even
when the output is shorted to ground. Shorting the output to either power supply will result in device failure.
To ensure proper operation, it is important to observe the derating curves and refer to the section on power
considerations.It must also be noted that in high (noninverting) gain configurations (with low values of gain
resistor), a high level of input overdrive can result in a large input error current, which may result in a
significant power dissipation in the input stage. This power must be included when computing the junction
temperature rise due to total internal power.