ADG711

V_DD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .0.3 V to +6 V
Analog, Digital Inputs2 . . . . . . . . . . .0.3 V to V_DD +0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . .100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . 40°C to +85°C
Storage Temperature Range . . . . . . . . .65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .+150°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . .430 mW
_JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 150°C/W
_JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 27°C/W
SOIC Package, Power Dissipation . . . . . . . . . . . . . .520 mW
_JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125°C/W
_JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . .42°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 kV
NOTES
¹Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
²Overvoltages at IN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.