ADG719

VDD to GND . . . . . . . . . . . . . . . . . . . . .. 0.3 V to +7 V
Analog, Digital Inputs2 . . . . . 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . .100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . .30 mA
Operating Temperature Range
    Industrial (B Version) . . . . . . . .    40°C to +85°C
Storage Temperature Range . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . +150°C
mSOIC Package, Power Dissipation . . . . . . . . .315 mW
    qJA Thermal Impedance . . . . . . . . . . . . . . 206°C/W
    qJC Thermal Impedance . . . . . . . . . . . . . .   44°C/W
SOT-23 Package, Power Dissipation . . . . . . .   282 mW
    qJA Thermal Impedance . . . . . . . . . . . . .229.6°C/W
    qJC Thermal Impedance . . . . . . . . . . . . .91.99°C/W
Lead Temperature, Soldering
    Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C
    Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
2 Overvoltages at IN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.