ADG774 General Description
ADG774 Maximum Ratings
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +6 V
Analog, Digital Inputs2 . . . . . . . . . . 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . 40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 600 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100°C/W
QSOP Package, Power Dissipation . . . . . . . . . . . . . . . 566 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . .. . 149.97°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C
I R Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . 2 kV
ADG774 Features
Low Insertion Loss and On Resistance: 2.2 Typical
On Resistance Flatness 0.5 Typical
Automotive Temperature Range
40C to +125C
3 dB Bandwidth = 240 MHz
Single 3 V/5 V Supply Operation
Rail-to-Rail Operation
Very Low Distortion: 0.5%
Low Quiescent Supply Current (1 nA Typical)
Fast Switching Times
tON 7 ns
tOFF 4 ns
TTL/CMOS Compatible
ADG774 Typical Application
USB 1.1 Signal Switching Circuits
Cell Phones
PDAs
Battery-Powered Systems
Communications Systems
Data Acquisition Systems
Token Ring 4 Mbps/16 Mbps
Audio and Video Switching
Relay Replacement
ADG774 Connection Diagram
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