ADP3502

Voltage on ADAPTER, ADPSUPPLY Pin
   to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . .. ... .0.3 V, 15 V
Voltage on VBAT Pin to GND . . . . . . . . . . . .. .  .0.3 V, +6.5 V
Voltage on Pins 613, 2128
   to GND . . . . . . . . . . . . . . . . . . . . . . .. 0.3 V, V_LDO1 + 0.3 V
Voltage on Pins 1, 6264 . . . . . . . . . . ..0.3 V, VBAT + 0.3 V
Voltage on Pins 20, 32 . . . . . . . . . . . . . 0.3 V, V_RTCV + 0.3 V
Voltage on Pin 60 . . . . . . . . . . . . .... 0.3 V, V_ADAPTER + 0.3 V
Voltage on Pins 25, 14, 30, 31, 33 . . . . .. . .. 0.3 V, +6.5 V
Storage Temperature Range . . . . . . . . . . .65°C to +150°C
Operating Temperature Range . . . . . . . . . . 30°C to +85°C
Maximum Junction Temperature . . . . . . . . . ... . . . . . . . 125°C
_JA Thermal Impedance (TQFP-64)
(2-Layer Board) . . . . . . . . . . . . . . . . . . . . . . . . . . . .87.4°C/W
_JA Thermal Impedance (TQFP-64)
(4-Layer Board) . . . . . . . . . . . . . . . . . . . . . . . . . .. . 56.2°C/W
Lead Temperature Range
(Soldering, 60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

*Stresses above those listed under Absolute Maximum Ratings may cause permanent
  damage to the device. This is a stress rating only; functional operation of the
  device at these or any other conditions above those listed in the operational
  sections of this specification is not implied. Exposure to absolute maximum rating
  conditions for extended periods may affect device reliability. Absolute maximum
  ratings apply individually only, not in combination. Unless otherwise specified all
  other voltages are referenced to GND.