ADSP-BF532SBSTZ400

The ADSP-BF532SBSTZ400 is a member of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). The features of ADSP-BF532SBSTZ400 are: (1)Up to 400MHz high performance Blackfin processor; (2)Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs, 40-bit shifter; (3)RISC-like register and instruction model for ease of programming and compiler-friendly support; (4)Advanced debug, trace, and performance monitoring 0.8 V to 1.2 V core VDD with on-chip voltage regulation 1.8 V, 2.5 V, and 3.3 V compliant I/O; (5)160-ball mini-BGA, 169-ball lead free PBGA, and 176-lead LQFP packages.

The following is about the absolute maximum ratings of ADSP-BF532SBSTZ400: (1)Internal (Core) Supply Voltage (VDDINT): 0.3 V to +1.4 V; (2)External (I/O) Supply Voltage (VDDEXT): 0.5 V to +3.8 V; (3)Input Voltage: 0.5 V to +3.8 V; (4)Output Voltage Swing: 0.5 V to VDDEXT+0.5 V; (5)Load Capacitance: 200 pF; (6)Storage Temperature Range: 65°C to +150°C; (7)Junction Temperature Under Bias: 125°C.

The electrical characteristics of the ADSP-BF532SBSTZ400 are: (1)Internal Supply Voltage: 0.8V min and 1.32V max; (2)External Supply Voltage: 1.75V min, 1.8/2.5/3.3 V typ and 3.6 V max; (3)Real-Time Clock Power Supply Voltage: 1.75V min, 1.8/2.5/3.3V typ and 3.6 V max; (4)High Level Input Voltage: 1.3V min and 1.85V max at VDDEXT =1.85 V ; (5)Level Input Voltage: -0.3V min and +0.3V max at VDDEXT =1.75 V; (6)Junction Temperature: 40 to +100 °C at 160-Ball Chip Scale Ball Grid Array (Mini-BGA) @ TAMBIENT = 40°C to +85°C.