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APF19-19-13CB

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SeekIC No. : 003444246 Detail

APF19-19-13CB: HEATSINK LOW-PROFILE FORGED

APF19-19-13CB Data Sheet

floor Price/Ceiling Price

US $ 8.91~8.91 / Piece | Get Latest Price
Part Number:
APF19-19-13CB
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~300
  • Unit Price
  • $8.91
  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2026/1/13

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Product Details

Quick Details

Capacitance : 16.5 pF Series: APF
Manufacturer: CTS Thermal Management Products Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square Length: 0.748" (19.00mm)
Width: 0.748" (19.00mm) Diameter: -
Height Off Base (Height of Fin): 0.500" (12.70mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 4.0°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Shape: Square
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Thermal Resistance @ Natural: -
Manufacturer: CTS Thermal Management Products
Height Off Base (Height of Fin): 0.500" (12.70mm)
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Series: APF
Length: 0.748" (19.00mm)
Width: 0.748" (19.00mm)
Thermal Resistance @ Forced Air Flow: 4.0°C/W @ 200 LFM


Parameters:

Technical/Catalog InformationAPF19-19-13CB
VendorCTS Thermal Management Products
CategoryFans, Thermal Management
Attachment MethodThermal Tape, Adhesive (Not Included)
Height0.5" (12.7mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow4.0°C/W @ 200 LFM
Outline19.00mm x 19.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names APF19 19 13CB
APF191913CB
294 1149 ND
2941149ND
294-1149



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