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Part Number: AT24HC02B-10PU

 

 

 

 

Description: The AT24HC02B provides 2048 bits of serial electrically erasable and programmable read-only memory (EE...


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AT24HC02B-10PU General Description


The AT24HC02B provides 2048 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 256 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and lowvoltage operation are essential. The AT24HC02B is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC and 8-lead TSSOP packages and is accessed via a t

AT24HC02B-10PU Maximum Ratings

Operating Temperature...................................−40°C to +85°C
Storage Temperature ...................................−65°C to +150°C
Voltage on Any Pin
with Respect to Ground.....................................−1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
*NOTICE: Stresses beyond those listed under "Absolute
Maximum Ratings" may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.

AT24HC02B-10PU Features

• Write Protect Pin for Hardware Data Protection
Utilizes Different Array Protection Compared to the AT24C02B
• Low-voltage and Standard-voltage Operation
1.8 (VCC = 1.8V to 5.5V)
• Internally Organized 256 x 8 (2K)
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz (5V) and 400 kHz (1.8V, 2.5V, 2.7V) Clock Rate
• 8-byte Page
• Partial Page Writes Allowed
• Self-timed Write Cycle (5 ms Max)
• High Reliability
Endurance: One Million Write Cycles
Data Retention: 100 Years
• 8-lead PDIP, 8-lead JEDEC SOIC and 8-lead TSSOP Packages
• Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers

AT24HC02B-10PU Connection Diagram

AT24HC02B-10PU  Connection Diagram

AT24HC02B-10PU datasheet

AT24HC02B-10PU-1.8
PDF/DataSheet Download

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