ATS-50230B-C2-R0

HEAT SINK 23MM X 23MM X 7.5MM

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SeekIC No. : 003444918 Detail

ATS-50230B-C2-R0: HEAT SINK 23MM X 23MM X 7.5MM

floor Price/Ceiling Price

US $ 3.62~5.55 / Piece | Get Latest Price
Part Number:
ATS-50230B-C2-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • Unit Price
  • $5.55
  • $4.25
  • $3.62
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/4/19

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Product Details

Quick Details

Capacitance : 6 pF Series: maxiGRIP, maxiFLOW
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: BGA Attachment Method: Clip, Thermal Material
Shape: Square, Angled Fins Length: 0.906" (23.01mm)
Width: 0.906" (23.01mm) Diameter: -
Height Off Base (Height of Fin): 0.295" (7.50mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 10.9°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Manufacturer: Advanced Thermal Solutions Inc
Shape: Square, Angled Fins
Material Finish: Blue Anodized
Series: maxiGRIP, maxiFLOW
Height Off Base (Height of Fin): 0.295" (7.50mm)
Length: 0.906" (23.01mm)
Width: 0.906" (23.01mm)
Attachment Method: Clip, Thermal Material
Thermal Resistance @ Forced Air Flow: 10.9°C/W @ 200 LFM


Parameters:

Technical/Catalog InformationATS-50230B-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodClip
Height0.295" (7.49mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow10.9°C/W @ 200 LFM
Outline23.00mm x 23.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 50230B C2 R0
ATS50230BC2R0
ATS1003 ND
ATS1003ND
ATS1003



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