ATS-54290D-C2-R0

HEAT SINK 29MM X 29MM X 9.5MM

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SeekIC No. : 003444628 Detail

ATS-54290D-C2-R0: HEAT SINK 29MM X 29MM X 9.5MM

floor Price/Ceiling Price

US $ 2.15~3.68 / Piece | Get Latest Price
Part Number:
ATS-54290D-C2-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~500
  • Unit Price
  • $3.68
  • $2.69
  • $2.23
  • $2.15
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/3/28

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Product Details

Quick Details

Capacitance : 16.5 pF Series: -
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square Length: 1.142" (29.01mm)
Width: 1.142" (29.01mm) Diameter: -
Height Off Base (Height of Fin): 0.374" (9.50mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 13.1°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Shape: Square
Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Attachment Method: Thermal Tape, Adhesive (Included)
Manufacturer: Advanced Thermal Solutions Inc
Height Off Base (Height of Fin): 0.374" (9.50mm)
Length: 1.142" (29.01mm)
Width: 1.142" (29.01mm)
Thermal Resistance @ Forced Air Flow: 13.1°C/W @ 200 LFM


Parameters:

Technical/Catalog InformationATS-54290D-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.375" (9.53mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow13.1°C/W @ 200 LFM
Outline29.00mm x 29.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 54290D C2 R0
ATS54290DC2R0
ATS1202 ND
ATS1202ND
ATS1202



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