ATS-55250R-C2-R0, US $ 3.22-6.07, ATS-55250R-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444708 Detail

ATS-55250R-C2-R0: HEAT SINK 25MM X 25MM X 19.5MM

ATS-55250R-C2-R0 Data Sheet

US $ 3.22~6.07 / Piece | Get Latest Price

Part Number:: ATS-55250R-C2-R0
Mfg:
Supply Ability:: 5000

Price Break

Qty
0~1
1~10
10~100
100~500
500~1000

Unit Price
$6.07
$4.44
$3.68
$3.38
$3.22

Processing time
15 Days
15 Days
15 Days
15 Days
15 Days

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Upload time: 2025/12/4

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	-
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	BGA	Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins	Length:	0.984" (24.99mm)
Width:	0.984" (24.99mm)	Diameter:	-
Height Off Base (Height of Fin):	0.768" (19.50mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	6.2°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Shape: Square, Pin Fins
Attachment Method: Thermal Tape, Adhesive (Included)
Length: 0.984" (24.99mm)
Width: 0.984" (24.99mm)
Manufacturer: Advanced Thermal Solutions Inc
Thermal Resistance @ Forced Air Flow: 6.2°C/W @ 200 LFM
Height Off Base (Height of Fin): 0.768" (19.50mm)

Parameters:

Technical/Catalog Information	ATS-55250R-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Thermal Tape, Adhesive (Included)
Height	0.77" (19.5mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	6.2°C/W @ 200 LFM
Outline	25.00mm x 25.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 55250R C2 R0 ATS55250RC2R0 ATS1302 ND ATS1302ND ATS1302

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ATS-55250R-C2-R0

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