HEAT SINK 33MM X 33MM X 9.5MM
ATS-55330D-C2-R0: HEAT SINK 33MM X 33MM X 9.5MM
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| Capacitance : | 16.5 pF | Series: | - |
| Manufacturer: | Advanced Thermal Solutions Inc | Type: | Top Mount |
| Package Cooled: | BGA | Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins | Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) | Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 12.3°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Technical/Catalog Information | ATS-55330D-C2-R0 |
| Vendor | Advanced Thermal Solutions Inc |
| Category | Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | 0.375" (9.53mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 12.3°C/W @ 200 LFM |
| Outline | 33.00mm x 33.00mm |
| Thermal Resistance @ Natural | - |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | ATS 55330D C2 R0 ATS55330DC2R0 ATS1274 ND ATS1274ND ATS1274 |