ATS-56008-C4-R0, US $ 7.6-13.28, ATS-56008-C4-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444588 Detail

ATS-56008-C4-R0: HEAT SINK 50MM X 45MM X 16MM

ATS-56008-C4-R0 Data Sheet

US $ 7.6~13.28 / Piece | Get Latest Price

Part Number:: ATS-56008-C4-R0
Mfg:
Supply Ability:: 5000

Price Break

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0~1
1~10
10~100
100~500
500~1000

Unit Price
$13.28
$10.16
$8.6
$7.88
$7.6

Processing time
15 Days
15 Days
15 Days
15 Days
15 Days

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	maxiFLOW
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	ASIC	Attachment Method:	Thermal Tape, Adhesive (Not Included)
Shape:	Rectangular, Angled Fins	Length:	1.969" (50.00mm)
Width:	1.772" (45.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.630" (16.00mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	2.1°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Thermal Resistance @ Forced Air Flow: 2.1°C/W @ 200 LFM
Thermal Resistance @ Natural: -
Type: Top Mount
Attachment Method: Thermal Tape, Adhesive (Not Included)
Series: maxiFLOW
Manufacturer: Advanced Thermal Solutions Inc
Package Cooled: ASIC
Width: 1.772" (45.00mm)
Length: 1.969" (50.00mm)
Shape: Rectangular, Angled Fins
Height Off Base (Height of Fin): 0.630" (16.00mm)

Parameters:

Technical/Catalog Information	ATS-56008-C4-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Thermal Tape, Adhesive (Not Included)
Height	0.630" (16.00mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	2.1°C/W @ 200 LFM
Outline	50.00mm x 45.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 56008 C4 R0 ATS56008C4R0 ATS1353 ND ATS1353ND ATS1353

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ATS-56008-C4-R0

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