ATS-56013-C3-R0, US $ 8.58-11.95, ATS-56013-C3-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444786 Detail

ATS-56013-C3-R0: HEAT SINK 42MM X 42MM X 16MM

ATS-56013-C3-R0 Data Sheet

US $ 8.58~11.95 / Piece | Get Latest Price

Part Number:: ATS-56013-C3-R0
Mfg:
Supply Ability:: 5000

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1~10
10~100

Unit Price
$11.95
$9.5
$8.58

Processing time
15 Days
15 Days
15 Days

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Product Details

Quick Details

Capacitance :	43 pF	Series:	maxiFLOW
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	ASIC	Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Angled Fins	Length:	1.653" (42.0mm)
Width:	1.653" (42.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.630" (16.00mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	2.2°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Thermal Resistance @ Natural: -
Type: Top Mount
Attachment Method: Thermal Tape, Adhesive (Included)
Series: maxiFLOW
Manufacturer: Advanced Thermal Solutions Inc
Shape: Square, Angled Fins
Package Cooled: ASIC
Thermal Resistance @ Forced Air Flow: 2.2°C/W @ 200 LFM
Height Off Base (Height of Fin): 0.630" (16.00mm)
Material Finish: Gold Anodized
Length: 1.653" (42.0mm)
Width: 1.653" (42.00mm)

Parameters:

Technical/Catalog Information	ATS-56013-C3-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Thermal Tape, Adhesive (Included)
Height	0.630" (16.00mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	2.2°C/W @ 200 LFM
Outline	42.00mm x 42.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 56013 C3 R0 ATS56013C3R0 ATS1344 ND ATS1344ND ATS1344

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ATS-56013-C3-R0

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