ATS-59000-C2-R0, US $ 11.57-19.01, ATS-59000-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444791 Detail

ATS-59000-C2-R0: HEAT SINK 21MM X 45MM X 9MM

ATS-59000-C2-R0 Data Sheet

US $ 11.57~19.01 / Piece | Get Latest Price

Part Number:: ATS-59000-C2-R0
Mfg:
Supply Ability:: 5000

Price Break

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0~1
1~10
10~100
100~500
500~1000

Unit Price
$19.01
$15.12
$13.03
$11.97
$11.57

Processing time
15 Days
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15 Days
15 Days
15 Days

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Product Details

Quick Details

Capacitance :	16.5 pF	Series:	maxiGRIP
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	Flip Chip Processors	Attachment Method:	Clip
Shape:	Rectangular, Angled Fins	Length:	0.827" (21.00mm)
Width:	1.772" (45.00mm)	Diameter:	-
Height Off Base (Height of Fin):	0.354" (9.00mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	6.1°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Attachment Method: Clip
Thermal Resistance @ Natural: -
Type: Top Mount
Length: 0.827" (21.00mm)
Manufacturer: Advanced Thermal Solutions Inc
Height Off Base (Height of Fin): 0.354" (9.00mm)
Width: 1.772" (45.00mm)
Shape: Rectangular, Angled Fins
Series: maxiGRIP
Package Cooled: Flip Chip Processors
Thermal Resistance @ Forced Air Flow: 6.1°C/W @ 200 LFM

Parameters:

Technical/Catalog Information	ATS-59000-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Clip
Height	0.35" (9mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	6.1°C/W @ 200 LFM
Outline	45.00mm x 21.00mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 59000 C2 R0 ATS59000C2R0 ATS1365 ND ATS1365ND ATS1365

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ATS-59000-C2-R0

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