HEAT SINK 25MM X 32MM X 13MM
ATS-59002-C2-R0: HEAT SINK 25MM X 32MM X 13MM
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| Capacitance : | 16.5 pF | Series: | maxiGRIP |
| Manufacturer: | Advanced Thermal Solutions Inc | Type: | Top Mount |
| Package Cooled: | Flip Chip Processors | Attachment Method: | Clip |
| Shape: | Rectangular, Angled Fins | Length: | 0.984" (24.99mm) |
| Width: | 1.260" (32.00mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.512" (13.00mm) | Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 6.5°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Technical/Catalog Information | ATS-59002-C2-R0 |
| Vendor | Advanced Thermal Solutions Inc |
| Category | Thermal Management |
| Attachment Method | Clip |
| Height | 0.51" (13mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 6.5°C/W @ 200 LFM |
| Outline | 32.00mm x 25.00mm |
| Thermal Resistance @ Natural | - |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | ATS 59002 C2 R0 ATS59002C2R0 ATS1367 ND ATS1367ND ATS1367 |