ATS-59003-C2-R0

HEAT SINK 32MM X 50MM X 12MM

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SeekIC No. : 003444533 Detail

ATS-59003-C2-R0: HEAT SINK 32MM X 50MM X 12MM

floor Price/Ceiling Price

US $ 7.59~12.47 / Piece | Get Latest Price
Part Number:
ATS-59003-C2-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~500
  • 500~1000
  • Unit Price
  • $12.47
  • $9.92
  • $8.55
  • $7.85
  • $7.59
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/3/28

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Product Details

Quick Details

Capacitance : 16.5 pF Series: maxiGRIP
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: Flip Chip Processors Attachment Method: Clip
Shape: Rectangular, Angled Fins Length: 1.260" (32.00mm)
Width: 1.969" (50.00mm) Diameter: -
Height Off Base (Height of Fin): 0.472" (12.00mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 3.8°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 3.8°C/W @ 200 LFM
Thermal Resistance @ Natural: -
Type: Top Mount
Manufacturer: Advanced Thermal Solutions Inc
Width: 1.969" (50.00mm)
Shape: Rectangular, Angled Fins
Series: maxiGRIP
Package Cooled: Flip Chip Processors
Length: 1.260" (32.00mm)
Height Off Base (Height of Fin): 0.472" (12.00mm)


Parameters:

Technical/Catalog InformationATS-59003-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodClip
Height0.47" (12mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow3.8°C/W @ 200 LFM
Outline50.00mm x 32.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 59003 C2 R0
ATS59003C2R0
ATS1368 ND
ATS1368ND
ATS1368



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