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Part Number: Am29LV033C

 

MFG: NEW

Package Cooled: 12

D/C: AMD

Description: The Am29LV033C is a 32 Mbit, 3.0 Volt-only Flash memory organized as 4,194,304 bytes. The device is of...


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Am29LV033C General Description


The Am29LV033C is a 32 Mbit, 3.0 Volt-only Flash memory organized as 4,194,304 bytes. The device is offered in 63-ball FBGA and 40-pin TSOP packages. The byte-wide (x8) data appears on DQ7DQ0. All read, program, and erase operations are accomplished using only a single power supply. The device can also be programmed in standard EPROM programmers.

The standard device offers access times of 70, 90, and 120 ns, allowing high speed microprocessors to operate
without wait states. To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls.

The device requires only a single 3.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations.

The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.

Device programming occurs by executing the program command sequence. This initiates the Embedded Program algorithm-an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. The Unlock Bypass mode facilitates faster programming times by requiring only two write cycles to program data instead of four.

Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase algorithm-an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin.

The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command.

The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory.

Hardware data protection measures include a low VCC detector that automatically inhibits write operations during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of the sectors of memory. This can be achieved in-system or via programming equipment.

The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. True background erase can thus be achieved.

The hardware RESET# pin terminates any operation in progress and resets the internal state machine to reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory.

The device offers two power-saving features. When addresses have been stable for a specified amount of  time, the device enters the automatic sleep mode. The system can also place the device into the standby mode. Power consumption is greatly reduced in both these modes.

AMD's Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The data is programmed using hot electron injection.

Am29LV033C Maximum Ratings

Storage Temperature
Plastic Packages . . . . . . . . . . . . . ...... . 65  to +150
Ambient Temperature
with Power Applied. . . . . . . . . . . . .... . 65  to +125
Voltage with Respect to Ground
    VCC (Note 1) . . . . . . . . . . . . . . ... .. .0.5 V to +4.0 V
    A9, OE#, and
    RESET# (Note 2) . . . . . . . . ..... .. . .0.5 V to +12.5 V
All other pins (Note 1) . . . . . ........ .0.5 V to VCC+0.5 V
Output Short Circuit Current (Note 3) . . . ........ . 200 mA

Notes:
1. Minimum DC voltage on input or I/O pins is 0.5 V. During voltage transitions, input or I/O pins may overshoot
    VSS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC voltage on input or I/O pins is VCC +
    0.5 V.  During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns.
    See Figure 8.

2. Minimum DC input voltage on pins A9, OE#, and RESET# is 0.5 V. During voltage transitions, A9, OE#,
   and  RESET# may overshoot VSS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input voltage
   on pin A9 is +12.5 V which may overshoot to 14.0 V for periods up to 20 ns.

3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be
    greater than one second.

Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.

Am29LV033C Features

` Supports Common Flash Memory Interface (CFI)
` Erase Suspend/Erase Resume
    - Suspends erase operations to allow programming in same bank
` Data# Polling and Toggle Bits
    - Provides a software method of detecting the status of program or erase cycles
` Unlock Bypass Program command
    - Reduces overall programming time when issuing multiple program command sequences
` Any combination of sectors can be erased
` Ready/Busy# output (RY/BY#)
    - Hardware method for detecting program or erase cycle completion
` Hardware reset pin (RESET#)
    - Hardware method of resetting the internal state machine to the read mode
` ACC input pin
    - Acceleration (ACC) function provides accelerated program times
`Sector protection
   - Hardware method of locking a sector, either in-system or using programming equipment, to prevent any
       program  or erase operation within that sector
   - Temporary Sector Unprotect allows changing data in protected sectors in-system
` Command sequence optimized for mass storage
    - Specific addresses not required for unlock cycles

Am29LV033C Connection Diagram

Am29LV033C  Connection Diagram

Am29LV033C datasheet

AM29LV033C
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