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MFG:AMD  Package Cooled:TSOP40  D/C:05+  

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Part Number: Am30LV0064D

 

MFG: AMD

Package Cooled: TSOP40

D/C: 05+

Description: The Am30LV0064D is a 64 Mbit mass storage Flash memory device, organized as 8 Kbyte (+256 byte) blocks...


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Am30LV0064D General Description


The Am30LV0064D is a 64 Mbit mass storage Flash memory device, organized as 8 Kbyte (+256 byte) blocks (1,024 blocks total), each with 16 pages of 512 (+16) bytes (16,384 pages total).

The device is suited to high-density applications in which data is sequential and requires frequent, fast write capability. The UltraNAND™ block and page architecture is capable of accommodating applications requiring IDE disk drive-compatible blocks.

Each device requires only a single 3.0 volt power supply for read, program, and erase functions. Internally generated and regulated voltages are provided for program and erase operations. A VCCQ pin is provided to allow 5 volts to be applied to the output buffer logic. With 5 volt tolerant inputs, the VCCQ pin provides the Flash device with 5 volt tolerant I/O.

The Am30LV0064D is entirely command set compatible with industry standard NAND instructions and timing. Commands are written to the command register through the 8-bit I/O bus using standard NAND write timing. Register contents serve as inputs to an internal state-machine that controls the read, erase, and programming circuitry. Write cycles also internally latch addresses and data needed for the read, programming, and erase operations. Reading data out of the device is similar to reading from NAND Flash devices. The device has an initial page read access time of 7 µs, with subsequent byte accesses of less than 50 ns per byte.

Device programming occurs on a page basis by executing the Input Data and Program Data command sequences. This initiates the Embedded Program algorithm -an internal algorithm that automatically times the program pulse widths and verifies proper cell margin.

Device erasure is performed on a block basis and occurs by executing the Block Erase command sequence. This initiates the Embedded Erase algorithm-an internal algorithm that automatically executes the erase operation.
During erase, the device automatically times the erase pulse widths and verifies proper cell margin. The block erase architecture allows memory blocks to be erased and reprogrammed without affecting the data contents of other blocks. The Erase Suspend/Erase Resume feature enables the user to put erase on hold for any period of time to read data from, or program data to, any block that is not selected for erasure. True background erase can thus be achieved. The device is fully erased when shipped from the factory.

The host system can detect whether a sequential read, program, or Block Erase operation is complete by observing
the RY/BY# pin or by reading the status register. After a program or erase cycle has been completed, the device is ready to accept another command.

Hardware data protection is provided by a write protect (WP#) input pin which inhibits all program and erase operations when asserted (low).

The device offers a standby mode as a power-saving feature. Once the system places the device into the standby mode power consumption is greatly reduced. AMD's Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effectiveness.
 

Am30LV0064D Maximum Ratings

Storage Temperature
Plastic Packages . . . . . . . . . . . . . . . 65°C to +150°C
Ambient Temperature
with Power Applied . . . . . . . . . . . . . 65°C to +125°C
Voltage with Respect to Ground
VCC (Note 1) . . . . . . . . . . . . . . . . .0.5 V to +4.0 V
VCCQ (Note 2) . . . . . . . . . . . . . . . .0.5 V to +6.0 V
All other pins (Note 1) . . . . . . 0.5 V to VCC +0.5 V
Output Short Circuit Current (Note 3) . . . . . . 200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is 0.5 V. During voltage transitions, input or I/O pins may overshoot VSS to 2.0 V for periods of up to 20 ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V. See Figure 13. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns. See Figure 14.
2. For 3.0 volt-only applications, VCCQ should be connected to VCC. To provide 5 V tolerant I/O, VCCQ should be
between 4.5 and 5.5 V.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater
than one second.
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.

Am30LV0064D datasheet

AM30LV0064D
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