B048K120T20

Features: • 48 V to 12 V V•I Chip Converter• 200 Watt (300 Watt for 1 ms)• High density up to 800 W/in3• Small footprint 200 W/in2• Low weight 0.5 oz (14 g)• ZVS/ZCS isolated amplitude converter• >96% efficiency• 125°C operation• 1 ...

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SeekIC No. : 004293573 Detail

B048K120T20: Features: • 48 V to 12 V V•I Chip Converter• 200 Watt (300 Watt for 1 ms)• High density up to 800 W/in3• Small footprint 200 W/in2• Low weight 0.5 oz (14 g)...

floor Price/Ceiling Price

Part Number:
B048K120T20
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/14

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Product Details

Description



Features:

• 48 V to 12 V V•I Chip Converter
• 200 Watt (300 Watt for 1 ms)
• High density up to 800 W/in3
• Small footprint 200 W/in2
• Low weight 0.5 oz (14 g)
• ZVS/ZCS isolated amplitude converter
• >96% efficiency
• 125°C operation
• 1 s transient response
• >3.5 million hours MTBF
• No output filtering required
• BGA or J-Lead packages



Specifications

Parameter Values Unit Notes
+In to -In -1.0 to 60.0 Vdc  
+In to -In 100 Vdc For 100 ms
PC to -In -0.3 to 7.0 Vdc  
TM to -In -0.3 to 7.0 Vdc  
+Out to -Out -0.5 to 15.0 Vdc  
Isolation voltage 2250 Vdc Input to Output
Operating junction temperature -40 to 125 °C T grade; See note 2
Output current 17.0 A Continuous
Peak output current 25 A For 1 ms
Case temperature during reflow 208 °C  
Storage temperature -40 to 150 °C  
Output power 200 W Continuous
Peak output power 300 W For 1 ms



Description

The V•I Chip Bus Converter Module (BCM) B048K120T20 is a high efficiency (>96%),narrow input range Voltage Transformation Module (VTM) operating from a 48 Vdc bus to deliver an isolated 12 V secondary for Intermediate Bus Architecture applications. The BCM may be used to power non-isolated POL converters or as an independent 12 V source. Due to the fast response time and low noise of the BCM B048K120T20, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced-or eliminated-in savings of board area,materials and total system cost.

The BCM B048K120T20 achieves a power density of 800 W/in3 and may be surface mounted with a profile as low as 0.16" (4mm) over the PCB. Its V•I Chip power package is compatible with on-board or in-board surface mounting. The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM B048K120T20 does not require a discrete heat sink in typical applications. It is also compatible with heat sink options,assuring low junction temperatures and long life in the harshest environments. 


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